New Process

View by Attribute: Physical Location

This page shows the location of tools in MTL. For tools in building 39, you can also go to the floor plan below to navigate the tools and locations.
Please note that historicall, the three labs (ICL,TRL,EML) were in each located on a specific floor in building 39 (ICL=2nd, TRL=4th, EML=5th). However, over the years this geographic separation is not exactly true anymore. Thus, you may find some ICL tools on the 5th floor in the EML space, or TRL tools on the 2nd floor in ICL. Please note that there is a very strict separation between samples processed in EML vs (TRL/ICL) tools, even for equipment that shares the same physical location.
We also included a more general map of the campus, with additional shared facilities that users often seek out - primarily for post-process analysis. Note that many of these are not cleanroom facilities, and therefore samples at outside labs are generally not permitted back into TRL or ICL (but are into EML).

        


AttributeDescriptionTool List
24-041 Bldg 24, Rm 041 Elionix,
2F 1-Hallway Etch 2nd Floor, 1-Hallway rainbow,
2F 1-North Deposition 2nd Floor, 1-North ALD,concept1,endura,
2F 1-NorthExtension Deposition 2nd Floor, 1-North Oxford-100_PECVD,Oxford-100_Etch,
2F 1-South Metrology 2nd Floor, 1-South 4-pt-probe,ALD-Oxford,cv,P10,UV1280,wykoICL,
2F 2-North Etch 2nd Floor, 2-North AFM,LAM490B,LAM590-ICL,
2F 2-NorthExtension 2nd Floor, 1-North
2F 2-South DepAndEtch 2nd Floor, 2-South AME5000,premetal-Piranha,
2F 3-North Photo 2nd Floor, 3-North i-stepper,semZeiss,
2F 3-South Photo 2nd Floor, 3-South asher-ICL,pTrack,nitrEtch-HotPhos,oxEtch-BOE,
2F 4-North Diffusion 2nd Floor, 4-North 5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,VTR,
2F 4-South Diffusion 2nd Floor, 4-South DCVD,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,
39-528 5th Floor, Room 528 epi-Centura,
4F Bonding 4th Floor, Bonding EV501,EV620,nanospec,TBM-8,
4F Deposition 4th Floor, Deposition Room AJA-TRL,eBeamAu,
4F Entry Diffusion 4th Floor, Entry A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,sts-CVD,
4F External-Deposition 4th Floor, External Deposition CCNT,eBeamFP,
4F External-Photo 4th Floor, External Photo Balzer-Elionix,Heidelberg,PMMAspinner,
4F Hallway 4th Floor, Hallway Greenflo,
4F Main-North 4th Floor, Main North asher-TRL,dek-NoAu,ellipsometer-TRL,Filmetrics-TRL,FLX,IV-probe,LAM590-TRL,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,SAMCO,WYKO,
4F Main-South 4th Floor, Main South acid-hood,asherMatrix-TRL,rca-TRL,RTA-HiT,sts1,sts2,sts-Pegasus,XeF2,
4F Photo-North 4th Floor, Photo North coater,develop-Brewer,EV-LC,HMDS-TRL,OAI-Flood,postbake,prebakeovn,SolventHood-TRL,
4F Photo-South 4th Floor, Photo South dektak-XT,hotplate1,hotplate2,hotplate300,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,PZTcoater,PZTfurnace,SU8oven,SU8spinner,UVozone-Au,varTemp,
5F 1-North 5th Floor, 1-North
5F 1-South Photo 5th Floor, 1-South coater-EML,photo-hood-EML,SolventHood-EML,
5F 2-North 5th Floor, 2-North TMAH-KOHhood,
5F 2-South Photo 5th Floor, 1-South
5F 3-South Packaging 5th Floor, 3-South hotpress,plasmatherm,2Dtransfer-platingHood,diesaw,
5F 4-South Photo 5th Floor, 1-South
5F Hallway 5th Floor, Hallway Dektak-150,
TBD Needs a room assignment acid-hood-EML,parametric-tester,SM-300,Hall-probe,Resonetics,Agilent5500_AFM,Cary_UV-Vis_Spec,Fluorescence_Spec,4_Point_Probe,Microscope-Inspect-4k,Microscope-Inspect-HD,
Web MTL Website Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-General,Procedures-Lithography,Procedures-Metrology,OutsideLab,CNS,NSL,SNL,
35-011 LEAP Packaging
8U 0 ALD-AllPurpose,Sputter-Balzer,EBeam-AJA,Filmetrics-F20,SEM-Neo,Sputter-AJA-ChamberLoad,PECVD-Samco-PD220,
4U 0 Anneal-Tube,Anneal-Box,Ox-Tube-Lindberg,RTA-900C,Vacuum-Oven,Plating-U04,
SoftLitho 0 Asher-SoftLitho,MaskAlign-SoftLitho-EV620,Microscope-Stereo-SU8,Mixer-PDMS-Degas,Oven-PDMS,PDMS-Prep,SoftLitho-Develop,SoftLitho-Prep,Spinner-SU8,SU8-Spinner-Hood,
Lv5 0 Diesaw-DAD3240,Wirebond-Ball-MEI,Wirebond-Auto,Wirebond-Ball-Westbond,Wirebond-Wedge,XRay-Inspection,DieBonder-PickAndPlace,Clean-Ar-Plasma,Oven-Reflow,Microscope-QuickVision,Freezer-Packaging,Microscope-Stereo-Packaging,Solder-Station,
2F 2-South Etch 0 eBeam-EVO,
12U 0 MaskAlign-MA6,Hotplate-Tower-U12,Oven-PostBake-U12,Oven-PreBake-U12,Spinner-AllPurpose,Develop-U12,General-Spinner-Hood-U12,
Lv1 0 Interference-LloydsMirror,
2U 0 AIR_Bladecoater,AIR_FOM,AIR_Spincoater,GB_Solar_Sim,GB_Spincoater,GB_Metals_Evaporator,GB_Organics_Evaporator,
6U 0 RIE-F-Samco-230iP,Coldplate-Solvent,Spinner-EBL,EBL-Spinner-Hood-U06,Acid-PreClean-U06,Solvent-Clean-U06,
10U 0 Hotplate-Tower-U10,Oven-PostBake-U10,Oven-PreBake-U10,Spinner-Resist,Develop-U10,Resist-Spinner-Hood-U10,SRD-U10,Acid-Etch-General-U10,Piranha-U10,
8L 0 Develop-L08,Liftoff-L08,
10L 0 Liftoff-L10,PhotoPrep-L10,
7U 0 CMP-GnP,Cleave-LatticeAx,Scribe-Backside,Scribe-Frontside,Acid-Extended-U07,Acid-PostCMP-U07,
6L 0 SRD-L06,NitrideEtch-Phos-L06,OxideEtch-HF-BOE-L06,Piranha-L06,RCA-General-L06,SiliconEtch-KOH-L06,Solvent-L06,Ops-ParticleCounter,Computers,
2L 0 RCA-Diffusion-L02,