New Process

View by Attribute: Process Category

The process categories are likely the most useful way to find tool capabilities. Start here, but keep in mind the difference between EML and ICL/TRL, and that samples once processed in EML cannot re-enter ICL or TRL. Also, please keep in mind the PTC Matrix, which establishes a set of rules to prevent cross-contamination of samples and tools.


AttributeDescriptionTool List
Deposition Deposition of material ALD-AllPurpose,Sputter-Balzer,EBeam-AJA,plasmatherm,Sputter-AJA-ChamberLoad,ALD,ALD-Oxford,concept1,DCVD,eBeam-EVO,endura,epi-Centura,Oxford-100_PECVD,Oxford-100_Etch,AJA-TRL,Balzer-Elionix,CCNT,eBeamAu,eBeamFP,parylene,PZTcoater,PZTfurnace,sts-CVD,PECVD-Samco-PD220,
Diffusion Diffusion, oxidation and annealing Anneal-Tube,Anneal-Box,Ox-Tube-Lindberg,RTA-900C,Vacuum-Oven,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,VTR,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,rca-TRL,RTA-HiT,
Etch Dry etching of materials plasmatherm,AME5000,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,rainbow,LAM590-TRL,plasmaquest,SAMCO,sts1,sts2,sts-Pegasus,UVozone-Au,XeF2,RIE-F-Samco-230iP,
Metrology Test and measurement Dektak-150,Filmetrics-F20,parametric-tester,SEM-Neo,4-pt-probe,AFM,cv,P10,semZeiss,SM-300,UV1280,wykoICL,dek-NoAu,dektak-XT,ellipsometer-TRL,Filmetrics-TRL,FLX,Hall-probe,IV-probe,nanospec,WYKO,Microscope-Inspect-4k,Microscope-Inspect-HD,Cleave-LatticeAx,Scribe-Backside,Scribe-Frontside,Microscope-Stereo-Packaging,
Packaging Device packaging diesaw,Diesaw-DAD3240,Wirebond-Ball-MEI,Wirebond-Auto,Wirebond-Ball-Westbond,Wirebond-Wedge,XRay-Inspection,DieBonder-PickAndPlace,Clean-Ar-Plasma,Oven-Reflow,Microscope-QuickVision,Freezer-Packaging,Solder-Station,
Photo Photolithography Elionix,Asher-SoftLitho,coater-EML,hotpress,asher-ICL,pTrack,i-stepper,asherMatrix-TRL,asher-TRL,coater,develop-Brewer,MaskAlign-SoftLitho-EV620,EV501,EV620,EV-LC,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,MaskAlign-MA6,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,OAI-Flood,PMMAspinner,postbake,prebakeovn,Resonetics,SU8oven,SU8spinner,TBM-8,varTemp,
Procedures General procedures Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-General,Procedures-Lithography,Procedures-Metrology,OutsideLab,CNS,NSL,SNL,
Wet Wet chemical processes, acids and solvents acid-hood-EML,photo-hood-EML,SolventHood-EML,2Dtransfer-platingHood,CMP-GnP,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,TMAH-KOHhood,acid-hood,Greenflo,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,SRD-L06,SRD-U10,Acid-Etch-General-U10,Acid-Extended-U07,Acid-PostCMP-U07,Acid-PreClean-U06,NitrideEtch-Phos-L06,OxideEtch-HF-BOE-L06,Piranha-L06,Piranha-U10,Plating-U04,RCA-Diffusion-L02,RCA-General-L06,SiliconEtch-KOH-L06,Solvent-Clean-U06,Solvent-L06,Ops-ParticleCounter,Computers,
Litho 0 Interference-LloydsMirror,Coldplate-Solvent,Hotplate-Tower-U10,Hotplate-Tower-U12,Oven-PostBake-U10,Oven-PostBake-U12,Oven-PreBake-U10,Oven-PreBake-U12,Spinner-AllPurpose,Spinner-EBL,Spinner-Resist,Develop-L08,Develop-U10,Develop-U12,EBL-Spinner-Hood-U06,General-Spinner-Hood-U12,Liftoff-L08,Liftoff-L10,PhotoPrep-L10,Resist-Spinner-Hood-U10,
NanoMat 0 AIR_Bladecoater,AIR_FOM,AIR_Spincoater,GB_Solar_Sim,GB_Spincoater,GB_Metals_Evaporator,GB_Organics_Evaporator,Agilent5500_AFM,Cary_UV-Vis_Spec,Fluorescence_Spec,4_Point_Probe,
TBD 0
SoftLitho Class 10k soft lithography space for SU8 and PDMS work Asher-SoftLitho,Dektak-150,MaskAlign-SoftLitho-EV620,Microscope-Stereo-SU8,Mixer-PDMS-Degas,Oven-PDMS,PDMS-Prep,SoftLitho-Develop,SoftLitho-Prep,Spinner-SU8,SU8-Spinner-Hood,