New Process

View by Attribute: Material Keyword

The material keywords help to identify which materials a tool is primarily processing. That is, the tool is either "acting upon" or "depositing" the particular material. For example, "silicon" can be deposited in the DCVD as amorphous-silicon, or etched in the sts1. On the other hand, the eBeamFP is a metal deposition tool, and while it can take "silicon" wafers, it does neither act on the silicon nor deposit it, so it's not a material keyword. The point here is to recognize that material keywords don't equate to "this material can go into the tool". Similarly, the main purpose of the tool must be related to that material. For example, the sts1 is a DRIE etcher, and while it does have oxygen and can in principle ash samples, this is not its purpose. So "photoresist" is not a material keyword, even though the tool can be abused into ashing samples.


AttributeDescriptionTool List
2D Materials Any transfer-deposited 2-D material (graphene, MoS2, etc) acid-hood-EML,plasmatherm,SolventHood-EML,Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,acid-hood,CCNT,Greenflo,plasmaquest,SAMCO,
Acids Acids or other corrosive chemicals that require personal protective equipment acid-hood-EML,2Dtransfer-platingHood,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,rca-ICL,TMAH-KOHhood,Procedures-Etching,acid-hood,Greenflo,rca-TRL,
CMOS Metals Metals that are compatible with CMOS devices acid-hood-EML,ALD-AllPurpose,Anneal-Tube,Anneal-Box,EBeam-AJA,parametric-tester,plasmatherm,RTA-900C,Sputter-AJA-ChamberLoad,2Dtransfer-platingHood,4-pt-probe,5B-Anneal,ALD,ALD-Oxford,pTrack,cv,eBeam-EVO,endura,CMP-GnP,Wirebond-Ball-MEI,Oxford-100_PECVD,Oxford-100_Etch,rainbow,RTA2,RTA-pieces,RTP,RTP-Si,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,eBeamAu,eBeamFP,Greenflo,Hall-probe,IV-probe,plasmaquest,Resonetics,RTA-HiT,SAMCO,Wirebond-Auto,Wirebond-Ball-Westbond,Wirebond-Wedge,
Developer Photoresist developers, either aqueous or solvent based photo-hood-EML,pTrack,Procedures-Lithography,develop-Brewer,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,SoftLitho-Develop,
Dielectrics Dielectric films acid-hood-EML,ALD-AllPurpose,Anneal-Tube,Anneal-Box,Filmetrics-F20,Ox-Tube-Lindberg,plasmatherm,RTA-900C,Sputter-AJA-ChamberLoad,5B-Anneal,ALD,ALD-Oxford,AME5000,concept1,CMP-GnP,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,UV1280,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,eBeamAu,ellipsometer-TRL,Filmetrics-TRL,Greenflo,LAM590-TRL,nanospec,plasmaquest,sts-CVD,
EBL Resist Resists sensitive for electron beam lithography Elionix,acid-hood-EML,Asher-SoftLitho,coater-EML,EBeam-AJA,Filmetrics-F20,photo-hood-EML,SolventHood-EML,asher-ICL,eBeam-EVO,premetal-Piranha,UV1280,Procedures-Cleaning,Procedures-General,Procedures-Lithography,asherMatrix-TRL,asher-TRL,coater,eBeamAu,eBeamFP,ellipsometer-TRL,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,SolventHood-TRL,varTemp,
GaN Gallium Nitride acid-hood-EML,plasmatherm,diesaw,Diesaw-DAD3240,CMP-GnP,rainbow,SM-300,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,develop-Brewer,Greenflo,plasmaquest,RTA-HiT,SAMCO,
III-V Any compound semiconductor acid-hood-EML,plasmatherm,diesaw,Diesaw-DAD3240,SM-300,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,develop-Brewer,Greenflo,plasmaquest,RTA-HiT,SAMCO,
Non-CMOS Metals Metals that are not CMOS compatible and contaminate Si based devices acid-hood-EML,Anneal-Tube,Sputter-Balzer,Anneal-Box,EBeam-AJA,parametric-tester,plasmatherm,RTA-900C,Sputter-AJA-ChamberLoad,2Dtransfer-platingHood,4-pt-probe,cv,CMP-GnP,Wirebond-Ball-MEI,Oxford-100_PECVD,Oxford-100_Etch,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,Balzer-Elionix,eBeamAu,eBeamFP,Greenflo,Hall-probe,IV-probe,plasmaquest,Resonetics,RTA-HiT,SAMCO,Wirebond-Auto,Wirebond-Ball-Westbond,Wirebond-Wedge,
None No specific material interaction Dektak-150,SEM-Neo,Vacuum-Oven,AFM,P10,semZeiss,wykoICL,B1-Au,dek-NoAu,dektak-XT,FLX,SU8oven,TBM-8,WYKO,XRay-Inspection,DieBonder-PickAndPlace,Clean-Ar-Plasma,Oven-Reflow,Microscope-QuickVision,OutsideLab,CNS,NSL,SNL,Freezer-Packaging,Interference-LloydsMirror,AIR_Bladecoater,AIR_FOM,AIR_Spincoater,GB_Solar_Sim,GB_Spincoater,GB_Metals_Evaporator,GB_Organics_Evaporator,Agilent5500_AFM,Cary_UV-Vis_Spec,Fluorescence_Spec,4_Point_Probe,PECVD-Samco-PD220,RIE-F-Samco-230iP,Coldplate-Solvent,Hotplate-Tower-U10,Hotplate-Tower-U12,Oven-PostBake-U10,Oven-PostBake-U12,Oven-PreBake-U10,Oven-PreBake-U12,Spinner-AllPurpose,Spinner-EBL,Spinner-Resist,Develop-L08,Develop-U10,Develop-U12,EBL-Spinner-Hood-U06,General-Spinner-Hood-U12,Liftoff-L08,Liftoff-L10,PhotoPrep-L10,Resist-Spinner-Hood-U10,Microscope-Inspect-4k,Microscope-Inspect-HD,Cleave-LatticeAx,Scribe-Backside,Scribe-Frontside,Microscope-Stereo-Packaging,Solder-Station,SRD-L06,SRD-U10,Acid-Etch-General-U10,Acid-Extended-U07,Acid-PostCMP-U07,Acid-PreClean-U06,NitrideEtch-Phos-L06,OxideEtch-HF-BOE-L06,Piranha-L06,Piranha-U10,Plating-U04,RCA-Diffusion-L02,RCA-General-L06,SiliconEtch-KOH-L06,Solvent-Clean-U06,Solvent-L06,Ops-ParticleCounter,Computers,
Non-Standard Materials Any non-standard semiconductor processing materials, often requiring special precautions acid-hood-EML,ALD-AllPurpose,Anneal-Tube,Anneal-Box,EBeam-AJA,Filmetrics-F20,Ox-Tube-Lindberg,plasmatherm,RTA-900C,SolventHood-EML,Sputter-AJA-ChamberLoad,ALD,ALD-Oxford,Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,AJA-TRL,asher-TRL,CCNT,eBeamAu,ellipsometer-TRL,Filmetrics-TRL,Greenflo,nanospec,parylene,plasmaquest,PZTcoater,PZTfurnace,
Other Polymers Any other (usually non-standard) polymer material acid-hood-EML,Asher-SoftLitho,coater-EML,Filmetrics-F20,hotpress,photo-hood-EML,SolventHood-EML,i-stepper,Oxford-100_PECVD,Oxford-100_Etch,Procedures-Cleaning,Procedures-Lithography,coater,ellipsometer-TRL,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,Resonetics,SolventHood-TRL,UVozone-Au,varTemp,Microscope-Stereo-SU8,Mixer-PDMS-Degas,Oven-PDMS,PDMS-Prep,SoftLitho-Develop,SoftLitho-Prep,Spinner-SU8,SU8-Spinner-Hood,
Photoresist UV light sensitive photoresists for contact and stepper lithography acid-hood-EML,Asher-SoftLitho,coater-EML,EBeam-AJA,Filmetrics-F20,photo-hood-EML,SolventHood-EML,asher-ICL,pTrack,eBeam-EVO,i-stepper,premetal-Piranha,UV1280,Procedures-Cleaning,Procedures-General,Procedures-Lithography,acid-hood,asherMatrix-TRL,asher-TRL,coater,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,MaskAlign-SoftLitho-EV620,EV-LC,Filmetrics-TRL,Greenflo,Heidelberg,hotplate1,hotplate2,hotplate300,MaskAlign-MA6,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,nanospec,OAI-Flood,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,postbake,prebakeovn,Resonetics,SolventHood-TRL,varTemp,
Polyimide Cleanroom compatible polyimide (photosensitive or not) acid-hood-EML,Asher-SoftLitho,coater-EML,Filmetrics-F20,photo-hood-EML,SolventHood-EML,i-stepper,UV1280,Procedures-Cleaning,Procedures-Lithography,coater,ellipsometer-TRL,MaskAlign-SoftLitho-EV620,EV-LC,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,MaskAlign-MA6,nanospec,OAI-Flood,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,Resonetics,SolventHood-TRL,varTemp,
Pyrex Pyrex glass, and therefore sodium contaminated acid-hood-EML,diesaw,Diesaw-DAD3240,Procedures-Etching,Procedures-Metrology,acid-hood,develop-Brewer,EV501,EV620,Greenflo,
Quartz Quartz, and therefore sodium free acid-hood-EML,diesaw,Diesaw-DAD3240,Procedures-Etching,Procedures-Metrology,acid-hood,develop-Brewer,Greenflo,
Silicon Silicon or polysilicon, as part of the wafer or deposited acid-hood-EML,Ox-Tube-Lindberg,plasmatherm,6A-nPoly,6B-Poly,AME5000,DCVD,diesaw,Diesaw-DAD3240,epi-Centura,CMP-GnP,LAM490B,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,SM-300,TMAH-KOHhood,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,acid-hood,B2-Ox-alloy-Poly,B4-Poly,develop-Brewer,EV501,EV620,Greenflo,HMDS-TRL,plasmaquest,Resonetics,RTA-HiT,sts1,sts2,sts-CVD,sts-Pegasus,XeF2,
SiNx Silicon nitride, stoichiometric or deposited acid-hood-EML,Anneal-Tube,Anneal-Box,Filmetrics-F20,plasmatherm,RTA-900C,5B-Anneal,6D-Nitride,AME5000,concept1,DCVD,CMP-GnP,LAM490B,LAM590-ICL,nitrEtch-HotPhos,Oxford-100_PECVD,Oxford-100_Etch,UV1280,VTR,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,ellipsometer-TRL,Filmetrics-TRL,Greenflo,HMDS-TRL,LAM590-TRL,nanospec,plasmaquest,sts1,sts2,sts-CVD,sts-Pegasus,
SiO2 Silicon dioxide, thermally grown or deposited acid-hood-EML,Anneal-Tube,Anneal-Box,Filmetrics-F20,Ox-Tube-Lindberg,plasmatherm,RTA-900C,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6C-LTO,AME5000,concept1,DCVD,CMP-GnP,LAM490B,LAM590-ICL,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,rca-ICL,UV1280,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A1-GateOx,A2-WetOxBond,A3-Sinter,acid-hood,B2-Ox-alloy-Poly,B3-DryOx,ellipsometer-TRL,Filmetrics-TRL,Greenflo,HMDS-TRL,LAM590-TRL,nanospec,plasmaquest,sts-CVD,
Solvents Cleanroom solvents photo-hood-EML,SolventHood-EML,Procedures-Cleaning,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,Microscope-Stereo-SU8,PDMS-Prep,SoftLitho-Develop,SoftLitho-Prep,Spinner-SU8,SU8-Spinner-Hood,
SU8 Cleanroom SU8 polymers (photosensitive or not) acid-hood-EML,coater-EML,Filmetrics-F20,photo-hood-EML,Procedures-Cleaning,Procedures-Lithography,ellipsometer-TRL,MaskAlign-SoftLitho-EV620,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,OAI-Flood,Resonetics,SU8spinner,Microscope-Stereo-SU8,SoftLitho-Develop,SoftLitho-Prep,Spinner-SU8,SU8-Spinner-Hood,