New Process

View by Attribute: Laboratory


AttributeDescriptionTool List
EBL Electron Beam Lithography Elionix,
EML Exploratory Materials Laboratory (5th floor) acid-hood-EML,coater-EML,hotpress,parametric-tester,photo-hood-EML,plasmatherm,SolventHood-EML,
ICL Integrated Circuits Laboratory (2nd floor) 4-pt-probe,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AFM,ALD,ALD-Oxford,AME5000,asher-ICL,pTrack,concept1,cv,DCVD,diesaw,eBeam-EVO,endura,epi-Centura,i-stepper,LAM490B,LAM590-ICL,nitrEtch-HotPhos,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,P10,premetal-Piranha,rainbow,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,semZeiss,SM-300,TMAH-KOHhood,UV1280,VTR,wykoICL,
MTL Microsystems Technology Laboratory (everything) Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-General,Procedures-Lithography,Procedures-Metrology,
TRL Technology Research Laboratory (4th floor) 2Dtransfer-platingHood,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,AJA-TRL,asherMatrix-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,Balzer-Elionix,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,IV-probe,LAM590-TRL,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,rca-TRL,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts1,sts2,sts-CVD,sts-Pegasus,SU8oven,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,
Other 0 OutsideLab,CNS,NSL,SNL,
LEAP LEAP Packaging
NANO 0 ALD-AllPurpose,Anneal-Tube,Asher-SoftLitho,Sputter-Balzer,Anneal-Box,Dektak-150,EBeam-AJA,Filmetrics-F20,Ox-Tube-Lindberg,RTA-900C,SEM-Neo,Sputter-AJA-ChamberLoad,Vacuum-Oven,Diesaw-DAD3240,CMP-GnP,Wirebond-Ball-MEI,MaskAlign-SoftLitho-EV620,MaskAlign-MA6,Wirebond-Auto,Wirebond-Ball-Westbond,Wirebond-Wedge,XRay-Inspection,DieBonder-PickAndPlace,Clean-Ar-Plasma,Oven-Reflow,Microscope-QuickVision,Freezer-Packaging,Interference-LloydsMirror,AIR_Bladecoater,AIR_FOM,AIR_Spincoater,GB_Solar_Sim,GB_Spincoater,GB_Metals_Evaporator,GB_Organics_Evaporator,Agilent5500_AFM,Cary_UV-Vis_Spec,Fluorescence_Spec,4_Point_Probe,PECVD-Samco-PD220,RIE-F-Samco-230iP,Coldplate-Solvent,Hotplate-Tower-U10,Hotplate-Tower-U12,Oven-PostBake-U10,Oven-PostBake-U12,Oven-PreBake-U10,Oven-PreBake-U12,Spinner-AllPurpose,Spinner-EBL,Spinner-Resist,Develop-L08,Develop-U10,Develop-U12,EBL-Spinner-Hood-U06,General-Spinner-Hood-U12,Liftoff-L08,Liftoff-L10,PhotoPrep-L10,Resist-Spinner-Hood-U10,Microscope-Inspect-4k,Microscope-Inspect-HD,Cleave-LatticeAx,Scribe-Backside,Scribe-Frontside,Microscope-Stereo-Packaging,Solder-Station,Microscope-Stereo-SU8,Mixer-PDMS-Degas,Oven-PDMS,PDMS-Prep,SoftLitho-Develop,SoftLitho-Prep,Spinner-SU8,SU8-Spinner-Hood,SRD-L06,SRD-U10,Acid-Etch-General-U10,Acid-Extended-U07,Acid-PostCMP-U07,Acid-PreClean-U06,NitrideEtch-Phos-L06,OxideEtch-HF-BOE-L06,Piranha-L06,Piranha-U10,Plating-U04,RCA-Diffusion-L02,RCA-General-L06,SiliconEtch-KOH-L06,Solvent-Clean-U06,Solvent-L06,Ops-ParticleCounter,Computers,