New Process

View by Attribute: General Keyword

The general keywords relate to how a tool is operated, and how it handles your samples. So you will see whether it has a cassette loader, requires manual operation, but also whether it is spinning your sample (which may not be good for fragile MEMS wafers) or whether it exposes your sample to elevated temperatures (e.g. the PECVD tools). These keywords can often be used to see which tools are not good choices for a certain requirement (e.g. if you have 6" wafers without a flat, which tools are not good choices).


AttributeDescriptionTool List
alignment Alignment Needed Elionix,Dektak-150,Filmetrics-F20,hotpress,parametric-tester,SEM-Neo,4-pt-probe,AFM,cv,diesaw,Diesaw-DAD3240,Wirebond-Ball-MEI,i-stepper,P10,semZeiss,UV1280,dek-NoAu,dektak-XT,ellipsometer-TRL,MaskAlign-SoftLitho-EV620,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Hall-probe,Heidelberg,IV-probe,MaskAlign-MA6,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,nanospec,Resonetics,TBM-8,Wirebond-Auto,DieBonder-PickAndPlace,Microscope-QuickVision,
anisotropic etch Anisotropic Etch AME5000,CMP-GnP,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,rainbow,TMAH-KOHhood,LAM590-TRL,plasmaquest,SAMCO,sts1,sts2,sts-Pegasus,
both sides of sample Both sides are processed acid-hood-EML,Asher-SoftLitho,hotpress,photo-hood-EML,SolventHood-EML,2Dtransfer-platingHood,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,rca-ICL,TMAH-KOHhood,VTR,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,FLX,Greenflo,HMDS-TRL,photo-wet-Au,photo-wet-l,photo-wet-r,postbake,prebakeovn,PZTfurnace,rca-TRL,SolventHood-TRL,varTemp,
conformal dep Conformal Deposition ALD-AllPurpose,Sputter-Balzer,plasmatherm,Sputter-AJA-ChamberLoad,2Dtransfer-platingHood,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,ALD,ALD-Oxford,pTrack,concept1,DCVD,endura,epi-Centura,Oxford-100_PECVD,Oxford-100_Etch,VTR,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,AJA-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,Balzer-Elionix,coater,HMDS-TRL,parylene,PMMAspinner,PZTcoater,sts-CVD,SU8spinner,
directional dep Directional Deposition EBeam-AJA,eBeam-EVO,CCNT,eBeamAu,eBeamFP,
isotropic etch Isotropic Etch acid-hood-EML,Asher-SoftLitho,photo-hood-EML,plasmatherm,SolventHood-EML,asher-ICL,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,rca-ICL,TMAH-KOHhood,acid-hood,asherMatrix-TRL,asher-TRL,Greenflo,photo-wet-Au,photo-wet-l,photo-wet-r,PZTfurnace,rca-TRL,Resonetics,SolventHood-TRL,UVozone-Au,XeF2,
load lock Load Lock Elionix,plasmatherm,Sputter-AJA-ChamberLoad,ALD-Oxford,AME5000,pTrack,concept1,DCVD,endura,epi-Centura,i-stepper,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,rainbow,RTA2,RTA-pieces,RTP,RTP-Si,AJA-TRL,eBeamFP,LAM590-TRL,plasmaquest,SAMCO,sts1,sts2,sts-CVD,sts-Pegasus,
manual load Manual Loading Elionix,acid-hood-EML,ALD-AllPurpose,Anneal-Tube,Anneal-Box,coater-EML,Dektak-150,EBeam-AJA,Filmetrics-F20,hotpress,Ox-Tube-Lindberg,parametric-tester,photo-hood-EML,RTA-900C,SEM-Neo,SolventHood-EML,Sputter-AJA-ChamberLoad,Vacuum-Oven,4-pt-probe,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AFM,ALD,cv,diesaw,Diesaw-DAD3240,CMP-GnP,Wirebond-Ball-MEI,nitrEtch-HotPhos,oxEtch-BOE,P10,premetal-Piranha,rca-ICL,semZeiss,SM-300,TMAH-KOHhood,VTR,wykoICL,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,AJA-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,Balzer-Elionix,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,MaskAlign-SoftLitho-EV620,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,IV-probe,MaskAlign-MA6,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,rca-TRL,Resonetics,RTA-HiT,SolventHood-TRL,sts1,SU8spinner,TBM-8,UVozone-Au,WYKO,XeF2,Wirebond-Auto,Wirebond-Ball-Westbond,Wirebond-Wedge,XRay-Inspection,DieBonder-PickAndPlace,Clean-Ar-Plasma,Oven-Reflow,Microscope-QuickVision,
manual operation Manual Operation Elionix,acid-hood-EML,ALD-AllPurpose,Anneal-Tube,Asher-SoftLitho,Sputter-Balzer,Anneal-Box,coater-EML,Dektak-150,EBeam-AJA,Filmetrics-F20,hotpress,Ox-Tube-Lindberg,parametric-tester,photo-hood-EML,RTA-900C,SEM-Neo,SolventHood-EML,Sputter-AJA-ChamberLoad,Vacuum-Oven,2Dtransfer-platingHood,4-pt-probe,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AFM,ALD,cv,diesaw,Diesaw-DAD3240,eBeam-EVO,CMP-GnP,Wirebond-Ball-MEI,nitrEtch-HotPhos,oxEtch-BOE,P10,premetal-Piranha,rca-ICL,semZeiss,SM-300,TMAH-KOHhood,wykoICL,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,AJA-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,Balzer-Elionix,CCNT,coater,dek-NoAu,dektak-XT,eBeamAu,ellipsometer-TRL,MaskAlign-SoftLitho-EV620,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Greenflo,Hall-probe,Heidelberg,hotplate1,hotplate2,hotplate300,IV-probe,MaskAlign-MA6,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,PZTcoater,PZTfurnace,rca-TRL,Resonetics,SolventHood-TRL,sts1,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,Wirebond-Ball-Westbond,Wirebond-Wedge,XRay-Inspection,Clean-Ar-Plasma,Oven-Reflow,
multi wafer Multiple Wafers Anneal-Tube,Anneal-Box,Ox-Tube-Lindberg,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AME5000,asher-ICL,pTrack,concept1,DCVD,eBeam-EVO,endura,epi-Centura,i-stepper,LAM490B,LAM590-ICL,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,rainbow,rca-ICL,RTP,RTP-Si,TMAH-KOHhood,UV1280,VTR,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,asherMatrix-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,eBeamAu,eBeamFP,Greenflo,HMDS-TRL,LAM590-TRL,postbake,prebakeovn,rca-TRL,sts-Pegasus,varTemp,
multiple pieces Multiple Pieces Elionix,acid-hood-EML,ALD-AllPurpose,Anneal-Tube,Asher-SoftLitho,Anneal-Box,EBeam-AJA,Ox-Tube-Lindberg,photo-hood-EML,RTA-900C,SolventHood-EML,Sputter-AJA-ChamberLoad,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,ALD,ALD-Oxford,Wirebond-Ball-MEI,Oxford-100_PECVD,Oxford-100_Etch,RTA2,RTA-pieces,semZeiss,TMAH-KOHhood,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,CCNT,eBeamAu,eBeamFP,Greenflo,HMDS-TRL,hotplate1,hotplate2,hotplate300,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,postbake,prebakeovn,PZTfurnace,RTA-HiT,SAMCO,SolventHood-TRL,sts-CVD,UVozone-Au,varTemp,XeF2,
None Procedures Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-General,Procedures-Lithography,Procedures-Metrology,OutsideLab,CNS,NSL,SNL,Freezer-Packaging,Interference-LloydsMirror,AIR_Bladecoater,AIR_FOM,AIR_Spincoater,GB_Solar_Sim,GB_Spincoater,GB_Metals_Evaporator,GB_Organics_Evaporator,Agilent5500_AFM,Cary_UV-Vis_Spec,Fluorescence_Spec,4_Point_Probe,PECVD-Samco-PD220,RIE-F-Samco-230iP,Coldplate-Solvent,Hotplate-Tower-U10,Hotplate-Tower-U12,Oven-PostBake-U10,Oven-PostBake-U12,Oven-PreBake-U10,Oven-PreBake-U12,Spinner-AllPurpose,Spinner-EBL,Spinner-Resist,Develop-L08,Develop-U10,Develop-U12,EBL-Spinner-Hood-U06,General-Spinner-Hood-U12,Liftoff-L08,Liftoff-L10,PhotoPrep-L10,Resist-Spinner-Hood-U10,Microscope-Inspect-4k,Microscope-Inspect-HD,Cleave-LatticeAx,Scribe-Backside,Scribe-Frontside,Microscope-Stereo-Packaging,Solder-Station,Microscope-Stereo-SU8,Mixer-PDMS-Degas,Oven-PDMS,PDMS-Prep,SoftLitho-Develop,SoftLitho-Prep,Spinner-SU8,SU8-Spinner-Hood,SRD-L06,SRD-U10,Acid-Etch-General-U10,Acid-Extended-U07,Acid-PostCMP-U07,Acid-PreClean-U06,NitrideEtch-Phos-L06,OxideEtch-HF-BOE-L06,Piranha-L06,Piranha-U10,Plating-U04,RCA-Diffusion-L02,RCA-General-L06,SiliconEtch-KOH-L06,Solvent-Clean-U06,Solvent-L06,Ops-ParticleCounter,Computers,
plasma Plasma Asher-SoftLitho,Sputter-Balzer,plasmatherm,Sputter-AJA-ChamberLoad,ALD-Oxford,AME5000,asher-ICL,concept1,DCVD,endura,epi-Centura,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,rainbow,VTR,AJA-TRL,asherMatrix-TRL,asher-TRL,Balzer-Elionix,CCNT,LAM590-TRL,plasmaquest,SAMCO,sts1,sts2,sts-CVD,sts-Pegasus,XeF2,Clean-Ar-Plasma,
requires flat Wafer-Flat Required DCVD,endura,epi-Centura,i-stepper,rainbow,RTP,RTP-Si,UV1280,FLX,sts-Pegasus,
single wafer Single Wafers Elionix,acid-hood-EML,ALD-AllPurpose,Asher-SoftLitho,coater-EML,Dektak-150,EBeam-AJA,Filmetrics-F20,hotpress,parametric-tester,photo-hood-EML,plasmatherm,RTA-900C,SEM-Neo,SolventHood-EML,Sputter-AJA-ChamberLoad,2Dtransfer-platingHood,4-pt-probe,AFM,ALD,ALD-Oxford,cv,diesaw,Diesaw-DAD3240,CMP-GnP,Oxford-100_PECVD,Oxford-100_Etch,P10,RTA2,RTA-pieces,semZeiss,SM-300,wykoICL,AJA-TRL,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,ellipsometer-TRL,MaskAlign-SoftLitho-EV620,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Hall-probe,Heidelberg,hotplate1,hotplate2,hotplate300,IV-probe,MaskAlign-MA6,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,PZTcoater,PZTfurnace,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts1,sts2,sts-CVD,SU8spinner,TBM-8,UVozone-Au,WYKO,XeF2,
spinning substrate Spinning Substrate coater-EML,pTrack,CMP-GnP,coater,develop-Brewer,PMMAspinner,PZTcoater,SU8spinner,
temperature Elevated Temperatures acid-hood-EML,ALD-AllPurpose,Anneal-Tube,Anneal-Box,hotpress,Ox-Tube-Lindberg,plasmatherm,RTA-900C,Vacuum-Oven,2Dtransfer-platingHood,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,ALD,ALD-Oxford,asher-ICL,pTrack,concept1,DCVD,epi-Centura,Wirebond-Ball-MEI,nitrEtch-HotPhos,Oxford-100_PECVD,Oxford-100_Etch,premetal-Piranha,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,TMAH-KOHhood,VTR,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,CCNT,EV501,FLX,Greenflo,HMDS-TRL,hotplate1,hotplate2,hotplate300,parylene,postbake,prebakeovn,PZTfurnace,rca-TRL,RTA-HiT,SAMCO,SolventHood-TRL,sts-CVD,sts-Pegasus,SU8oven,varTemp,Wirebond-Auto,Wirebond-Ball-Westbond,Wirebond-Wedge,Clean-Ar-Plasma,Oven-Reflow,
top side of sample Top side is processed Elionix,ALD-AllPurpose,Anneal-Tube,Sputter-Balzer,Anneal-Box,coater-EML,Dektak-150,EBeam-AJA,Filmetrics-F20,Ox-Tube-Lindberg,plasmatherm,RTA-900C,SEM-Neo,Sputter-AJA-ChamberLoad,4-pt-probe,AFM,ALD,ALD-Oxford,AME5000,asher-ICL,pTrack,concept1,cv,DCVD,diesaw,Diesaw-DAD3240,eBeam-EVO,endura,epi-Centura,CMP-GnP,Wirebond-Ball-MEI,i-stepper,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,P10,rainbow,RTA2,RTA-pieces,RTP,RTP-Si,semZeiss,SM-300,UV1280,wykoICL,AJA-TRL,asherMatrix-TRL,Balzer-Elionix,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,MaskAlign-SoftLitho-EV620,EV501,EV620,EV-LC,Filmetrics-TRL,Hall-probe,Heidelberg,hotplate1,hotplate2,hotplate300,IV-probe,LAM590-TRL,MaskAlign-MA6,DirectWrite-MLA150-OptAF,DirectWrite-MLA150-AirAF,nanospec,OAI-Flood,parylene,plasmaquest,PMMAspinner,PZTcoater,Resonetics,RTA-HiT,SAMCO,sts1,sts2,sts-CVD,sts-Pegasus,SU8spinner,TBM-8,UVozone-Au,WYKO,XeF2,
vacuum Vacuum Elionix,ALD-AllPurpose,Anneal-Tube,Asher-SoftLitho,Sputter-Balzer,Anneal-Box,EBeam-AJA,Ox-Tube-Lindberg,plasmatherm,RTA-900C,SEM-Neo,Sputter-AJA-ChamberLoad,ALD,ALD-Oxford,AME5000,asher-ICL,concept1,DCVD,eBeam-EVO,endura,epi-Centura,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,rainbow,RTA2,RTA-pieces,RTP,RTP-Si,semZeiss,VTR,AJA-TRL,asherMatrix-TRL,asher-TRL,Balzer-Elionix,CCNT,eBeamAu,eBeamFP,HMDS-TRL,LAM590-TRL,parylene,plasmaquest,Resonetics,RTA-HiT,SAMCO,sts1,sts2,sts-CVD,sts-Pegasus,UVozone-Au,XeF2,