Equipment
Lab and Coral NameEML / plasmatherm
ModelPlasmatherm
SpecialistKurt Broderick    (Gary Riggott)
Physical Location5F 3-South Packaging
Classification
Process CategoryDeposition, Etch
SubcategoryPECVD, RIE
Material KeywordsSilicon, III-V, GaN, SiO2, SiNx, Dielectrics, CMOS Metals, Non-CMOS Metals, Non-Standard Materials, 2D Materials
Sample Size6" Wafers, 4" Wafers, Pieces
Alternative?
Keywordssingle wafer, load lock, top side of sample, isotropic etch, conformal dep, vacuum, plasma, temperature
Description
The plasmatherm is a dual chamber PECVD-RIE that etches & deposits dielectrics; heated chuck

Best forGeneral purpose etch and deposition
Limitations
Characteristics/FOMCl2, BCl3, SF6, CF4, CHF3 RIE A-Si, SiO2, SiN PECVD
Caution with
Machine Charges (academic rate)7pu/wafer + 1pu/um
Documents

SOP
PlasmathermSOP for the plasmatherm
Process Matrix Details


PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL