Equipment
Lab and Coral NameTRL / coater
ModelSolitec 5110
SpecialistDavid Terry    (Paul Tierney)
Physical Location4F Photo-North
Classification
Process CategoryPhoto
SubcategoryCoat
Material KeywordsPolyimide, Other Polymers, Photoresist, EBL Resist
Sample Size6" Wafers, 4" Wafers, Pieces
AlternativeTRL / PMMAspinner
Keywordssingle wafer, manual load, top side of sample, conformal dep, manual operation, spinning substrate
Description
The coater is a multi-stage spinner that can be programmed with separate speed/time settings for dispense, spread, and spin. Auto-dispense of resist is available for SPR700-1.0, AZ5214E, AZ4620. The coating is done one piece or one wafer at a time.

Best forPR coating (built-in SPR700, AZ5214E, AZ4620). Different chucks for wafers and pieces.
LimitationsOne sample at a time with manual loading.
Characteristics/FOMSPR700, AZ5214E, AZ4620. User-supplied PTC approved resists.
Caution withMount corresponding chuck for RED and GREEN processes. Keep hands off while spinning. Fragile wafers can fly off chuck and break if vacuum not good.
Machine Charges (academic rate)2pu/wafer
Documents

SOP
Resist RecipesBaseline resist recipes for TRL
Target-MountingHow to handle-mount wafers for the sts1 and sts2

Documents
AZ5214EDatasheet for AZ5214E image reversal resist
AZ4620Datasheet for AZ4620 thick resist
PhotoresistApplication Note describing photoresist chemistry
Liftoff ResistApplication Note describing liftoff resists
Image reversalApplication Note describing image reversal
CoatingApplication Note describing spincoating
Developing ResistApplication Note describing resist development
PI SelectionApplication Note describing polyimide choices
HD4100Datasheet for HD4100 polyimide
maN2400Datasheet for maN2400 e-beam resist

External Links
GuideMicroChem Application Notes
Process Matrix Details

Permitted
Been in the ALDSamples that have been in any of the ALD systems
,
Pyrex SubstratesPyrex substrates can be a concern due to high sodium content, which contaminates CMOS frontend tools
,
III-V SubstratesAny III-V substrates, e.g. GaAs, GaN, InP, and so on. Note though that many common III-V substrates will also carry the Au flag, but there are some GREEN III-V substrates.
,
Germanium on surfaceSamples with germanium on the surface (typically grown films)
,
Germanium buriedSamples with germanium buried below a different film
,
PiecesWafer pieces may not be handled by the equipment, and are harder to thoroughly clean - preventing them from running in certain tools.
,
Gold or RED color codeRED color code substrates. These are gold-contaminated or have been processed in gold contaminated tools. Gold and other metals can contaminate silicon devices (GREEN color code) and have to be separated.
,
Any exposure to CMOS metalIf the sample had ever seen a CMOS metal (or a tool that accepts CMOS metal), then some frontend tools could be contaminated by this.
,
CMOS metal on surfaceCMOS compatible metals exposed on the surface. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
,
CMOS metal buriedCMOS compatible metals covered entirely by a different material. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
,
Been in the STS DRIEThe DRIE etch leaves behind polymer residues on the sidewall ripples, which can be a contamination concern for some tools.
,
Been in the SEMA sample viewed in the SEM must have used the appropriate chuck to avoid cross-contamination
,
Been in the Concept1The Concep1 deposits dielectrics on GREEN wafers, however it also accepts metal and there can be cross-contamination for diffusion area
,
Has PhotoresistSamples with photoresist cannot be exposed to high temperatures, which is typical in deposition tools. Outgassing can be a concern.
,
Has PolyimidePolyimide is a very chemically resistant polymer, and can tolerate higher temperatures but cannot be exposed to typical PECVD deposition temperatures or diffusion furnaces. Outgassing can be a concern.
,
Coming from KOHAfter a KOH etch, the samples must receive a special clean because the K ions are highly contaminating to CMOS frontend tools
,
Coming from CMPAfter a CMP, the samples must receive a special clean, because the slurry residues otherwise introduce contamination and particles.


Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL
,
Has Cured SU8Not fully cured SU8 residues can heavily contaminated plasma chambers or destroy other user's samples, but fully cured SU8 is permitted in certain tools.


For more details or help, please consult PTC matrix, email ptc@mtl.mit.edu, or ask the research specialist (David Terry)