Lab and Coral NameEML / acid-hood-EML
SpecialistKurt Broderick    (Gary Riggott)
Physical LocationTBD
Process CategoryWet
Material KeywordsSilicon, III-V, GaN, Quartz, Pyrex, SiO2, SiNx, Dielectrics, CMOS Metals, Non-CMOS Metals, Non-Standard Materials, 2D Materials, Polyimide, SU8, Other Polymers, Photoresist, EBL Resist, Acids
Sample Size6" Wafers, 4" Wafers, 7" Photo Plates, 5" Photo Plates, Pieces
AlternativeTRL / acid-hood
Keywordssingle wafer, manual load, multiple pieces, both sides of sample, isotropic etch, temperature, manual operation
The acid hood in EML allows for sample cleaning and film etching using a wide variety of available chemicals. Hot plates are also available for chemical processing at elevated temperatures. Quartz, Teflon, and other plastics chemical containers are available for use with compatible chemicals. Sample holders include 6" and 4" Teflon wafer boats in addition to small sample holders. N2 gun available for sample drying.

Best forExperimental materials
LimitationsNo dump-rinser, chemical aspirator, or SRD available. Need to manually dilute acids and rinse for a long time (for what seems like an eternity) when disposing.
Caution withBe careful with rinsing and disposal, to avoid accidental splashes or spills. Check PPE before and after use for splashes, discard and replace sleeves or gloves if not safe.
Machine Charges (academic rate)8pu/run

Wet ProcessingRules and guidelines for wet processing

Etch rates part 2Berkeley etch rate paper
Process Matrix Details

PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL