Lab and Coral NameNANO / Wirebond-Auto
ModelWestBond 747-630
SpecialistTimothy Turner    (Daniel A. Adams)
Physical LocationLv5
Process CategoryPackaging
SubcategoryPhysical, LEAP
Material KeywordsCMOS Metals, Non-CMOS Metals
Sample SizePieces
AlternativeLEAP / BallBonder, LEAP / WedgeBonder
Keywordsmanual load, temperature, alignment
Semi-automatic wire bonding tool: 747630. Supports ultrasonic, thermo-sonic and thermo-compression fine wire, ribbon, and ball bonding. Unique design features qualify the 353637F Series for the microwave, semiconductor, R.F., and hybrid devices where precision and repeatability are critical. Custom mounting brackets can be designed to join to customer’s mechanism. A simple exchange of wire clamp assemblies, provided with this model, allows conventional 45º wire feed, deep access 90º wire or ribbon feed, ball-wedge, ball-stud, and single point tab/lead bonding, all within a single tool head. All programmed bond variables and machine settings are retained in memory and retrieved automatically upon conversion.

Best forBonding a complex part that is challenging to use a manual bonder. Bonding arrays of wires
LimitationsNot recommended for one-offs, because it requires setup of the process for each bond style
Caution withMoving parts
Machine Charges (academic rate)3pu/hour
Process Matrix Details

Been in the ALDSamples that have been in any of the ALD systems
Pyrex SubstratesPyrex substrates can be a concern due to high sodium content, which contaminates CMOS frontend tools
III-V SubstratesAny III-V substrates, e.g. GaAs, GaN, InP, and so on. Note though that many common III-V substrates will also carry the Au flag, but there are some GREEN III-V substrates.
Germanium on surfaceSamples with germanium on the surface (typically grown films)
Germanium buriedSamples with germanium buried below a different film
PiecesWafer pieces may not be handled by the equipment, and are harder to thoroughly clean - preventing them from running in certain tools.
Gold or RED color codeRED color code substrates. These are gold-contaminated or have been processed in gold contaminated tools. Gold and other metals can contaminate silicon devices (GREEN color code) and have to be separated.
Any exposure to CMOS metalIf the sample had ever seen a CMOS metal (or a tool that accepts CMOS metal), then some frontend tools could be contaminated by this.
CMOS metal on surfaceCMOS compatible metals exposed on the surface. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
CMOS metal buriedCMOS compatible metals covered entirely by a different material. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
Been in the STS DRIEThe DRIE etch leaves behind polymer residues on the sidewall ripples, which can be a contamination concern for some tools.
Been in the SEMA sample viewed in the SEM must have used the appropriate chuck to avoid cross-contamination
Been in the Concept1The Concep1 deposits dielectrics on GREEN wafers, however it also accepts metal and there can be cross-contamination for diffusion area
Has PhotoresistSamples with photoresist cannot be exposed to high temperatures, which is typical in deposition tools. Outgassing can be a concern.
Has PolyimidePolyimide is a very chemically resistant polymer, and can tolerate higher temperatures but cannot be exposed to typical PECVD deposition temperatures or diffusion furnaces. Outgassing can be a concern.
Has Cured SU8Not fully cured SU8 residues can heavily contaminated plasma chambers or destroy other user's samples, but fully cured SU8 is permitted in certain tools.
Coming from KOHAfter a KOH etch, the samples must receive a special clean because the K ions are highly contaminating to CMOS frontend tools
Coming from CMPAfter a CMP, the samples must receive a special clean, because the slurry residues otherwise introduce contamination and particles.

Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL

For more details or help, please consult PTC matrix, email, or ask the research specialist (Timothy Turner)