Lab and Coral NameNANO / Spinner-SU8
ModelApogee CEE
SpecialistKurt Broderick    (Dennis Ward)
Physical LocationSoftLitho
Process CategorySoftLitho
SubcategorySU8, Coat
Material KeywordsSU8, Other Polymers, Solvents
Sample Size8" Wafers, 6" Wafers, 4" Wafers
AlternativeNANO / Spinner-AllPurpose
The SU8 spinner is restricted to spin coating of SU8 type epoxy resists, often used to make PDMS molds for fluidic applications. The SU8 spinner is not meant for regular photoresist coating (use the regular Spinner-AllPurpose instead). Different SU8 types can be poured or pipetted onto the wafer in a static dispense (dispense without rotation). In addition, the coater comes with four plumbed lines: (1) a thin-SU8 2005 type to easily coat a 3-5um thin base layer of SU8 which can help with adhesion/spinning of thicker SU8 films. (2) PGMEA solvent to spin-develop wafers. (3) IPA as a rinse after developing. (4) PGMEA as a backside edge bead remover to produce a residue free wafer backside. Most SU8 processing is done on 4" wafers, but the coater also handles 6" and 8" wafers.

Best forSU8 spin coating
Limitationswafers only
Characteristics/FOMPlumbed line SU8 2005, PGMEA (propylene glycol methyl ether acetate), IPA (isopropyl alcohol), PGMEA EBR (edge bead removal)
Caution withReplace gloves after handling SU8, to avoid spreading residues
Machine Charges (academic rate)2pu/wafer

SPR700Datasheet for SPR700 standard resist
PhotoresistApplication Note describing photoresist chemistry
Liftoff ResistApplication Note describing liftoff resists
CoatingApplication Note describing spincoating
Developing ResistApplication Note describing resist development

External Links
SU8 FAQsLots of tips & tricks about SU8
Process Matrix Details

Been in the ALDSamples that have been in any of the ALD systems
Pyrex SubstratesPyrex substrates can be a concern due to high sodium content, which contaminates CMOS frontend tools
III-V SubstratesAny III-V substrates, e.g. GaAs, GaN, InP, and so on. Note though that many common III-V substrates will also carry the Au flag, but there are some GREEN III-V substrates.
Germanium on surfaceSamples with germanium on the surface (typically grown films)
Germanium buriedSamples with germanium buried below a different film
PiecesWafer pieces may not be handled by the equipment, and are harder to thoroughly clean - preventing them from running in certain tools.
Gold or RED color codeRED color code substrates. These are gold-contaminated or have been processed in gold contaminated tools. Gold and other metals can contaminate silicon devices (GREEN color code) and have to be separated.
Any exposure to CMOS metalIf the sample had ever seen a CMOS metal (or a tool that accepts CMOS metal), then some frontend tools could be contaminated by this.
CMOS metal on surfaceCMOS compatible metals exposed on the surface. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
CMOS metal buriedCMOS compatible metals covered entirely by a different material. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
Been in the STS DRIEThe DRIE etch leaves behind polymer residues on the sidewall ripples, which can be a contamination concern for some tools.
Been in the SEMA sample viewed in the SEM must have used the appropriate chuck to avoid cross-contamination
Been in the Concept1The Concep1 deposits dielectrics on GREEN wafers, however it also accepts metal and there can be cross-contamination for diffusion area
Has PhotoresistSamples with photoresist cannot be exposed to high temperatures, which is typical in deposition tools. Outgassing can be a concern.
Has PolyimidePolyimide is a very chemically resistant polymer, and can tolerate higher temperatures but cannot be exposed to typical PECVD deposition temperatures or diffusion furnaces. Outgassing can be a concern.
Has Cured SU8Not fully cured SU8 residues can heavily contaminated plasma chambers or destroy other user's samples, but fully cured SU8 is permitted in certain tools.
Coming from KOHAfter a KOH etch, the samples must receive a special clean because the K ions are highly contaminating to CMOS frontend tools
Coming from CMPAfter a CMP, the samples must receive a special clean, because the slurry residues otherwise introduce contamination and particles.

Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL

For more details or help, please consult PTC matrix, email, or ask the research specialist (Kurt Broderick)