Equipment
Lab and Coral NameTRL / SU8spinner
Model0
SpecialistDennis Ward     (David Terry)
Physical Location4F Photo-South
Classification
Process CategoryPhoto
SubcategoryCoat
Material KeywordsSU8
Sample Size6" Wafers, 4" Wafers, Pieces
Alternativenone
Keywordssingle wafer, manual load, top side of sample, conformal dep, manual operation, spinning substrate
Description
The SU8spinner is a spinner to coat wafers and pieces with SU8. You must bring your own SU8 to dispense. Important: Please be very careful NOT to use regular labware, as SU8 contamination is damaging for plasma tools and other users' samples. Only use SU8 labeled tweezers and beakers, and place Al foil on hotplates for baking. Only the [EV1] is allowed for exposing SU8, with the proper SU8 labeled chuck. Developing must take place in the SU8 hood, not the regular photo area.

Best forSU8 spin coating.
LimitationsOnly SU8 2000 series are allowed because of quicker drying and greater acetone solubility of uncured resist.
Characteristics/FOMRefer to www.microchem.com for spin speed curves and bake times/temperatures.
Caution withOnly use special SU8 labware to handle wafers during SU8 processing. Clean all SU8 traces on labware or counter with acetone before it hardens. Different types of SU8 have different prebake requirements.
Machine Charges (academic rate)3pu/wafer
Documents

SOP
SU8 spinnerSOP for the SU8 spinner
Resist RecipesBaseline resist recipes for TRL
PDMSHow to make PDMS molds

Documents
SPR700Datasheet for SPR700 standard resist
PhotoresistApplication Note describing photoresist chemistry
Liftoff ResistApplication Note describing liftoff resists
CoatingApplication Note describing spincoating
Developing ResistApplication Note describing resist development
SU8Datasheet for SU8 resists

External Links
GuideMicroChem Application Notes
Process Matrix Details

Permitted
Been in the ALDSamples that have been in any of the ALD systems
,
Pyrex SubstratesPyrex substrates can be a concern due to high sodium content, which contaminates CMOS frontend tools
,
III-V SubstratesAny III-V substrates, e.g. GaAs, GaN, InP, and so on. Note though that many common III-V substrates will also carry the Au flag, but there are some GREEN III-V substrates.
,
Germanium on surfaceSamples with germanium on the surface (typically grown films)
,
Germanium buriedSamples with germanium buried below a different film
,
PiecesWafer pieces may not be handled by the equipment, and are harder to thoroughly clean - preventing them from running in certain tools.
,
Gold or RED color codeRED color code substrates. These are gold-contaminated or have been processed in gold contaminated tools. Gold and other metals can contaminate silicon devices (GREEN color code) and have to be separated.
(Adds),
Any exposure to CMOS metalIf the sample had ever seen a CMOS metal (or a tool that accepts CMOS metal), then some frontend tools could be contaminated by this.
,
CMOS metal on surfaceCMOS compatible metals exposed on the surface. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
,
CMOS metal buriedCMOS compatible metals covered entirely by a different material. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
,
Been in the STS DRIEThe DRIE etch leaves behind polymer residues on the sidewall ripples, which can be a contamination concern for some tools.
,
Been in the SEMA sample viewed in the SEM must have used the appropriate chuck to avoid cross-contamination
,
Been in the Concept1The Concep1 deposits dielectrics on GREEN wafers, however it also accepts metal and there can be cross-contamination for diffusion area
,
Has PhotoresistSamples with photoresist cannot be exposed to high temperatures, which is typical in deposition tools. Outgassing can be a concern.
,
Has PolyimidePolyimide is a very chemically resistant polymer, and can tolerate higher temperatures but cannot be exposed to typical PECVD deposition temperatures or diffusion furnaces. Outgassing can be a concern.
,
Has Cured SU8Not fully cured SU8 residues can heavily contaminated plasma chambers or destroy other user's samples, but fully cured SU8 is permitted in certain tools.
,
Coming from KOHAfter a KOH etch, the samples must receive a special clean because the K ions are highly contaminating to CMOS frontend tools
,
Coming from CMPAfter a CMP, the samples must receive a special clean, because the slurry residues otherwise introduce contamination and particles.


Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL


For more details or help, please consult PTC matrix, email ptc@mtl.mit.edu, or ask the research specialist (Dennis Ward )