Equipment
Lab and Coral NameNANO / Oven-Reflow
ModelATV SRO 700
SpecialistTimothy Turner    (Daniel A. Adams)
Physical LocationLv5
Classification
Process CategoryPackaging
SubcategoryBake, LEAP
Material KeywordsNone
Sample Size6" Wafers, 4" Wafers, 5" Photo Plates, Pieces
AlternativeNone
Keywordsmanual load, temperature, manual operation
Description
IR Vacuum Reflow System. SRO-700 table top IR vacuum reflow oven, has rapid thermal annealing and brazing capabilities the SRO-700 supports reflow soldering applications. A cold wall chamber principle in combination with the IR lamp heating technology and vacuum support process repeatability and void free solder joints. 100 mm clearance over the heated surface the system can handle products like IGBT and power electronics packages. Supports flux, flux less or solder paste a versatile reflow oven for semiconductor and MEMS application. Chamber Height: 100mm, Heated Area: 230 x 217mm, IR Heating: Array of 8 IR lamps in Quartz glass tubes (2 Heating zones). Common Applications SRO-700:IGBT/DBC, Power Semiconductors, Sensors, MEMS Devices, DIE Attachment, High Power LED, Hybrid Assembly, Flip Chip, Package Sealing. Features SRO-700:Flux-less, with Flux and solder paste, formic acid enriched atmosphere, direct IR Heating, multiple TC monitoring, process temperature 450C up to 700C, temperature ramp-up rate 3.5K/sec, temperature cool-down rate 2K/sec., Rapid single wafer processing < 20C/sec, oxygen < 1,0ppm with purified N2.

Best forReflow process after epoxy bonding
LimitationsHighest temperature is 400C
Characteristics/FOMN2
Caution with
Machine Charges (academic rate)3pu/hour
Documents
Process Matrix Details

Permitted
Been in the ALDSamples that have been in any of the ALD systems
,
Pyrex SubstratesPyrex substrates can be a concern due to high sodium content, which contaminates CMOS frontend tools
,
III-V SubstratesAny III-V substrates, e.g. GaAs, GaN, InP, and so on. Note though that many common III-V substrates will also carry the Au flag, but there are some GREEN III-V substrates.
,
Germanium on surfaceSamples with germanium on the surface (typically grown films)
,
Germanium buriedSamples with germanium buried below a different film
,
PiecesWafer pieces may not be handled by the equipment, and are harder to thoroughly clean - preventing them from running in certain tools.
,
Gold or RED color codeRED color code substrates. These are gold-contaminated or have been processed in gold contaminated tools. Gold and other metals can contaminate silicon devices (GREEN color code) and have to be separated.
,
Any exposure to CMOS metalIf the sample had ever seen a CMOS metal (or a tool that accepts CMOS metal), then some frontend tools could be contaminated by this.
,
CMOS metal on surfaceCMOS compatible metals exposed on the surface. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
,
CMOS metal buriedCMOS compatible metals covered entirely by a different material. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
,
Been in the STS DRIEThe DRIE etch leaves behind polymer residues on the sidewall ripples, which can be a contamination concern for some tools.
,
Been in the SEMA sample viewed in the SEM must have used the appropriate chuck to avoid cross-contamination
,
Been in the Concept1The Concep1 deposits dielectrics on GREEN wafers, however it also accepts metal and there can be cross-contamination for diffusion area
,
Has PhotoresistSamples with photoresist cannot be exposed to high temperatures, which is typical in deposition tools. Outgassing can be a concern.
,
Has PolyimidePolyimide is a very chemically resistant polymer, and can tolerate higher temperatures but cannot be exposed to typical PECVD deposition temperatures or diffusion furnaces. Outgassing can be a concern.
,
Has Cured SU8Not fully cured SU8 residues can heavily contaminated plasma chambers or destroy other user's samples, but fully cured SU8 is permitted in certain tools.
,
Coming from KOHAfter a KOH etch, the samples must receive a special clean because the K ions are highly contaminating to CMOS frontend tools
,
Coming from CMPAfter a CMP, the samples must receive a special clean, because the slurry residues otherwise introduce contamination and particles.


Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL


For more details or help, please consult PTC matrix, email ptc@mtl.mit.edu, or ask the research specialist (Timothy Turner)