Equipment
Lab and Coral NameNANO / EBL-Spinner-Hood-U06
ModelAir Control
SpecialistPaul Tierney    (David Terry)
Physical Location6U
Classification
Process CategoryLitho
SubcategoryCoat
Material KeywordsNone
Sample Size8" Wafers, 6" Wafers, 4" Wafers, 7" Photo Plates, 5" Photo Plates, Pieces
AlternativeNANO / Resist-Spinner-Hood-U10
KeywordsNone
Description
The EBL spinner bench is a stainless steel sovent bench designated for coating, baking, and developing of resists used in electron beam lithography. It houses the Spinner-EBL and several hotplates for prebaking of PMMA and HSQ. It also contains an ultrasonic water bath for solvent cleaning. The bath is meant for cleaning only, and not for liftoff (for which the Liftoff-L10 bench is to be used) - in order to avoid metal flake contamination. The Spinner-AllPurpose is a suitable backup tool.

Best forPMMA and HSQ coating, baking and developing for electron beam resists. Non-liftoff solvent cleaning of samples
LimitationsLocated in white light area, thus restricted to use with PMMA and HSQ. No liftoff procedures.
Characteristics/FOM
Caution with
Machine Charges (academic rate)8pu/hour
Documents

Documents
SPR700Datasheet for SPR700 standard resist
PhotoresistApplication Note describing photoresist chemistry
Liftoff ResistApplication Note describing liftoff resists
CoatingApplication Note describing spincoating
Developing ResistApplication Note describing resist development
Process Matrix Details

Permitted
Been in the ALDSamples that have been in any of the ALD systems
,
Pyrex SubstratesPyrex substrates can be a concern due to high sodium content, which contaminates CMOS frontend tools
,
III-V SubstratesAny III-V substrates, e.g. GaAs, GaN, InP, and so on. Note though that many common III-V substrates will also carry the Au flag, but there are some GREEN III-V substrates.
,
Germanium on surfaceSamples with germanium on the surface (typically grown films)
,
Germanium buriedSamples with germanium buried below a different film
,
PiecesWafer pieces may not be handled by the equipment, and are harder to thoroughly clean - preventing them from running in certain tools.
,
Gold or RED color codeRED color code substrates. These are gold-contaminated or have been processed in gold contaminated tools. Gold and other metals can contaminate silicon devices (GREEN color code) and have to be separated.
,
Any exposure to CMOS metalIf the sample had ever seen a CMOS metal (or a tool that accepts CMOS metal), then some frontend tools could be contaminated by this.
,
CMOS metal on surfaceCMOS compatible metals exposed on the surface. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
,
CMOS metal buriedCMOS compatible metals covered entirely by a different material. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
,
Been in the STS DRIEThe DRIE etch leaves behind polymer residues on the sidewall ripples, which can be a contamination concern for some tools.
,
Been in the SEMA sample viewed in the SEM must have used the appropriate chuck to avoid cross-contamination
,
Been in the Concept1The Concep1 deposits dielectrics on GREEN wafers, however it also accepts metal and there can be cross-contamination for diffusion area
,
Has PhotoresistSamples with photoresist cannot be exposed to high temperatures, which is typical in deposition tools. Outgassing can be a concern.
,
Has PolyimidePolyimide is a very chemically resistant polymer, and can tolerate higher temperatures but cannot be exposed to typical PECVD deposition temperatures or diffusion furnaces. Outgassing can be a concern.
,
Has Cured SU8Not fully cured SU8 residues can heavily contaminated plasma chambers or destroy other user's samples, but fully cured SU8 is permitted in certain tools.
,
Coming from KOHAfter a KOH etch, the samples must receive a special clean because the K ions are highly contaminating to CMOS frontend tools
,
Coming from CMPAfter a CMP, the samples must receive a special clean, because the slurry residues otherwise introduce contamination and particles.


Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL


For more details or help, please consult PTC matrix, email ptc@mtl.mit.edu, or ask the research specialist (Paul Tierney)