Lab and Coral NameNANO / DieBonder-PickAndPlace
ModelMRSI M-3
SpecialistTimothy Turner    (Daniel A. Adams)
Physical LocationLv5
Process CategoryPackaging
SubcategoryPhysical, LEAP
Material KeywordsNone
Sample SizePieces
Keywordsmanual load, alignment
An industry standard for ultra-precision, high-complexity die attach in high volume production environments. This system includes force control, ultra-precise placements, and 360 die orientation, the MRSI-M3 die bonder ensures high yields, high quality and high reliability in advanced packaging. The system has 3-micron accuracy, automation, speed and reliability; in-situ assembly processes such as eutectic die bonding, UV epoxy die attach and flip chip assembly are all possible. The MRSI-M3 3-Micron die bonder is used for ultrasound modules microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages. The MRSI-M3 3-micron die bonder supports sizes from mall dies to large sensors provides all the capability and flexibility to assemble the most advanced packages.

Best forHigh-speed pick and place of chips, including epoxy dispense. Ideal for large numbers of chips, as well as precision placement of very small chips
LimitationsNot recommended for one-offs, because it requires setup of image recognition for each part
Characteristics/FOMN2, Epoxy
Caution withmoving parts
Machine Charges (academic rate)3pu/hour
Process Matrix Details

Been in the ALDSamples that have been in any of the ALD systems
Pyrex SubstratesPyrex substrates can be a concern due to high sodium content, which contaminates CMOS frontend tools
III-V SubstratesAny III-V substrates, e.g. GaAs, GaN, InP, and so on. Note though that many common III-V substrates will also carry the Au flag, but there are some GREEN III-V substrates.
Germanium on surfaceSamples with germanium on the surface (typically grown films)
Germanium buriedSamples with germanium buried below a different film
PiecesWafer pieces may not be handled by the equipment, and are harder to thoroughly clean - preventing them from running in certain tools.
Gold or RED color codeRED color code substrates. These are gold-contaminated or have been processed in gold contaminated tools. Gold and other metals can contaminate silicon devices (GREEN color code) and have to be separated.
Any exposure to CMOS metalIf the sample had ever seen a CMOS metal (or a tool that accepts CMOS metal), then some frontend tools could be contaminated by this.
CMOS metal on surfaceCMOS compatible metals exposed on the surface. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
CMOS metal buriedCMOS compatible metals covered entirely by a different material. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
Been in the STS DRIEThe DRIE etch leaves behind polymer residues on the sidewall ripples, which can be a contamination concern for some tools.
Been in the SEMA sample viewed in the SEM must have used the appropriate chuck to avoid cross-contamination
Been in the Concept1The Concep1 deposits dielectrics on GREEN wafers, however it also accepts metal and there can be cross-contamination for diffusion area
Has PhotoresistSamples with photoresist cannot be exposed to high temperatures, which is typical in deposition tools. Outgassing can be a concern.
Has PolyimidePolyimide is a very chemically resistant polymer, and can tolerate higher temperatures but cannot be exposed to typical PECVD deposition temperatures or diffusion furnaces. Outgassing can be a concern.
Has Cured SU8Not fully cured SU8 residues can heavily contaminated plasma chambers or destroy other user's samples, but fully cured SU8 is permitted in certain tools.
Coming from KOHAfter a KOH etch, the samples must receive a special clean because the K ions are highly contaminating to CMOS frontend tools
Coming from CMPAfter a CMP, the samples must receive a special clean, because the slurry residues otherwise introduce contamination and particles.

Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL

For more details or help, please consult PTC matrix, email, or ask the research specialist (Timothy Turner)