Lab and Coral NameICL / ALD-Oxford
ModelOxford FlexAl
SpecialistDonal Jamieson    (Robert Bicchieri)
Physical Location2F 1-South Metrology
Process CategoryDeposition
SubcategoryCVD, PECVD
Material KeywordsDielectrics, CMOS Metals, Non-Standard Materials
Sample Size6" Wafers, 4" Wafers, Pieces
AlternativeICL / ALD
Keywordssingle wafer, multiple pieces, load lock, top side of sample, conformal dep, vacuum, plasma, temperature
The ALD-Oxford is a atomic layer deposition tool that can deposit Al2O3, AlN, HfO2 and TiN. It can deposit layers both by plasma- and thermal-assisted processing. Films of <5 nm thicknesses can be deposited with good uniformity and at relatively low temperatures. Deposition can be done on materials such as Si and "GREEN" III-N samples. Proper cleaning procedures (RCA or PIRHANA) are required on samples before deposition, to maintain a high level of cleanliness in the system. No metals are allowed in the tool.

Best forDeposition of gate dielectric layers, conformal and uniform deposition for <5 nm layers.
LimitationsSlow deposition rate, relatively thin layers.
Characteristics/FOMPlasma or thermal assisted ALD deposition.
Caution withSample cleaning is required (RCA or PIRAHNA). Photoresist (or any polymer) and metals are not allowed in this tool.
Machine Charges (academic rate)7pu/wafer + 0.12pu/nm

Oxford ALDSOP for the Oxford ALD
Process Matrix Details

Been in the ALDSamples that have been in any of the ALD systems
III-V SubstratesAny III-V substrates, e.g. GaAs, GaN, InP, and so on. Note though that many common III-V substrates will also carry the Au flag, but there are some GREEN III-V substrates.
Germanium on surfaceSamples with germanium on the surface (typically grown films)
Germanium buriedSamples with germanium buried below a different film
PiecesWafer pieces may not be handled by the equipment, and are harder to thoroughly clean - preventing them from running in certain tools.
Any exposure to CMOS metalIf the sample had ever seen a CMOS metal (or a tool that accepts CMOS metal), then some frontend tools could be contaminated by this.
CMOS metal on surfaceCMOS compatible metals exposed on the surface. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
CMOS metal buriedCMOS compatible metals covered entirely by a different material. These are Al,Ni,Pt,Ti,TiN. Other metals such as Au are *NOT* part of this.
Been in the SEMA sample viewed in the SEM must have used the appropriate chuck to avoid cross-contamination
Been in the Concept1The Concep1 deposits dielectrics on GREEN wafers, however it also accepts metal and there can be cross-contamination for diffusion area
Coming from KOHAfter a KOH etch, the samples must receive a special clean because the K ions are highly contaminating to CMOS frontend tools
Coming from CMPAfter a CMP, the samples must receive a special clean, because the slurry residues otherwise introduce contamination and particles.

Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL
Pyrex SubstratesPyrex substrates can be a concern due to high sodium content, which contaminates CMOS frontend tools
Gold or RED color codeRED color code substrates. These are gold-contaminated or have been processed in gold contaminated tools. Gold and other metals can contaminate silicon devices (GREEN color code) and have to be separated.
Been in the STS DRIEThe DRIE etch leaves behind polymer residues on the sidewall ripples, which can be a contamination concern for some tools.
Has PhotoresistSamples with photoresist cannot be exposed to high temperatures, which is typical in deposition tools. Outgassing can be a concern.
Has PolyimidePolyimide is a very chemically resistant polymer, and can tolerate higher temperatures but cannot be exposed to typical PECVD deposition temperatures or diffusion furnaces. Outgassing can be a concern.
Has Cured SU8Not fully cured SU8 residues can heavily contaminated plasma chambers or destroy other user's samples, but fully cured SU8 is permitted in certain tools.
Has been past RCA clean for over 4 hoursFor some diffusion furnaces, the samples must immideatly enter the furnace and cannot be stored in a box for a long time.

For more details or help, please consult PTC matrix, email, or ask the research specialist (Donal Jamieson)