New Process

Machines by Sample Size: Pieces Require Puck

Some tools can process pieces, but require a special mounting procedure or the use of a special puck (not just a dummy wafer to sit on).
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ProcessLabToolKeywords0Description
Color Code
  +  
ICL concept1 ERRORERROR PECVD deposition of oxides, nitrides, and TEOS
Green
  +  
ICL endura ERRORERROR Metal sputter deposition
Green
  +  
NANO CMP-GnP ERRORERROR Chemical Mechanical Polishing to planarize surfaces
Red &Green
  +  
ICL i-stepper ERRORERROR i-line stepper
Red &Green
  +  
ICL LAM490B ERRORERROR Chlorine based plasma etching of silicon
Green
  +  
ICL LAM590-ICL ERRORERROR Fluorine based plasma etching of silicon oxide and nitrides
Green
  +  
ICL rainbow ERRORERROR Chlorine based plasma etcher for metals
Green
  +  
ICL RTA2 ERRORERROR Rapid Thermal Annealing
Green
  +  
ICL RTA-pieces ERRORERROR Rapid Thermal Annealing
Red
  +  
ICL RTP ERRORERROR Rapid Thermal Annealing
Green
  +  
ICL RTP-Si ERRORERROR Rapid Thermal Annealing
Green
  +  
ICL UV1280 ERRORERROR Thin film characterization
Green
  +  
ICL VTR ERRORERROR Low stress silicon nitride deposition
Green
  +  
TRL asherMatrix-TRL ERRORERROR Single wafer oxygen plasma for photoresist removal
Red
  +  
TRL LAM590-TRL ERRORERROR Fluorine based plasma etching of oxide and nitrides
Red
  +  
TRL sts1 ERRORERROR Deep reactive ion etcher for silicon
Red
  +  
TRL sts2 ERRORERROR Deep reactive ion etcher for silicon
Green
  +  
TRL sts-Pegasus ERRORERROR Deep reactive ion etcher for silicon
Red