New Process

Machines by Specialist: Eric Lim


Eric Lim
Research Engineer, Vacuum Etching / Equipment Maintenance
39-215 - (617)253-6897 - eslim@mtl.mit.edu
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ProcessLabToolProcess CategorySubcategoryDescription
Color Code
  +  
NANO RTA-900C DiffusionBake Rapid Thermal Annealing
Red
  +  
ICL 4-pt-probe MetrologyElectrical Sheet resistance measurement of semiconductors
Red
  +  
ICL 5A-GateOx DiffusionOxidation Diffusion tube for gate oxide growth
Green
  +  
ICL 5B-Anneal DiffusionBake Annealing tube
Green
  +  
ICL 5C-FieldOx DiffusionOxidation Diffusion tube for wet oxide growth of thicker films
Green
  +  
ICL 5D-ThickOx DiffusionOxidation Diffusion tube for wet oxide growth of thicker films
Green
  +  
ICL 6A-nPoly DiffusionCVD Polysilicon deposition tube for n-type poly Si
Green
  +  
ICL 6B-Poly DiffusionCVD Polysilicon deposition tube for p-type poly Si
Green
  +  
ICL 6C-LTO DiffusionCVD Low temperature CVD oxide deposition
Green
  +  
ICL 6D-Nitride DiffusionCVD Deposition of stoichiometric silicon nitride
Green
  +  
ICL AFM MetrologyProfile Atomic Force Microscope for Surface Analysis
Red &Green
  +  
ICL AME5000 EtchRIE RIE etcher for frontend silicon processes
Green
  +  
ICL concept1 DepositionPECVD PECVD deposition of oxides, nitrides, and TEOS
Green
  +  
ICL cv MetrologyElectrical Electrical characterization of dielectrics
Green
  +  
ICL DCVD DepositionPECVD PECVD deposition of oxides, nitrides, and a-Si
Green
  +  
ICL eBeam-EVO DepositionEvaporate Metal evaporator of CMOS compatible metals
Green
  +  
ICL endura DepositionSputter Metal sputter deposition
Green
  +  
ICL P10 MetrologyProfile Stylus profilerometer
Green
  +  
ICL rainbow EtchRIE Chlorine based plasma etcher for metals
Green
  +  
ICL rca-ICL DiffusionClean Wafer cleaning before diffusion tubes
Green
  +  
ICL RTA2 DiffusionBake Rapid Thermal Annealing
Green
  +  
ICL RTA-pieces DiffusionBake Rapid Thermal Annealing
Red
  +  
ICL RTP DiffusionBake Rapid Thermal Annealing
Green
  +  
ICL RTP-Si DiffusionBake Rapid Thermal Annealing
Green
  +  
ICL SM-300 MetrologyThickness Thickness measurement for CMP processing
Red &Green
  +  
ICL UV1280 MetrologyThickness Thin film characterization
Green
  +  
ICL wykoICL MetrologyProfile Optical profiling system
Green
MTL Procedures-Etching ProceduresEtch Etching of materials
Red &Green
MTL Procedures-Metrology ProceduresMetrology Test and Measurement
Red &Green
  +  
TRL A1-GateOx DiffusionOxidation Thermal Oxidation for Green Silicon Wafers
Green
  +  
TRL A2-WetOxBond DiffusionOxidation Thermal Oxidation and other thermal process for GREEN Si wafers
Green
  +  
TRL A3-Sinter DiffusionBake Sintering for GREEN Si wafers
Green
  +  
TRL A4-III-Vanneal DiffusionBake Annealing for GREEN III-V samples
Red
  +  
TRL AJA-TRL DepositionSputter Sputter deposition tool
Red
  +  
TRL B1-Au DiffusionOxidation Gold compatible anneal tube
Red
  +  
TRL B2-Ox-alloy-Poly DiffusionOxidation Thermal Oxidation and LPCVD Polysilicon for RED wafers
Green
  +  
TRL B3-DryOx DiffusionOxidation Thermal Oxidation
Green
  +  
TRL B4-Poly DiffusionCVD LPCVD polysilicon for Green wafers
Green
  +  
TRL rca-TRL DiffusionClean Wafer cleaning before diffusion tubes
Green
  +  
TRL RTA-HiT DiffusionBake Rapid Thermal Annealing
Red
  +  
TRL SAMCO EtchRIE Chlorine based plasma etcher for III-V materials
Red
  +  
NANO RIE-F-Samco-230iP EtchRIE Fluorine based etcher for silicon dielectrics
Red &Green