New Process

Machines by Specialist: Dennis Ward


Dennis Ward
Research Specialist
39-561 - (617)452-4905 - ward@mtl.mit.edu
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ProcessLabToolProcess CategorySubcategoryDescription
Color Code
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TRL Balzer-Elionix DepositionSputter SEM or EBL sample preparation
Red
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TRL develop-Brewer PhotoCoat Resist develop and postbake
Red &Green
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TRL EV501 PhotoBond Bonder system to apply heat, vacuum and pressure
Red &Green
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TRL EV620 PhotoBond Aligner for bonding
Red &Green
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TRL Filmetrics-TRL MetrologyThickness Thin film thickness measurement
Red &Green
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TRL FLX MetrologyProfile Thin film stress measurement
Red &Green
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TRL Heidelberg PhotoExpose Laser direct-write exposure for wafers and masks
Red &Green
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TRL DirectWrite-MLA150-OptAF PhotoExpose Direct-write lithography for wafers and larger pieces
Red &Green
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TRL DirectWrite-MLA150-AirAF PhotoExpose Direct-write lithography for wafers and larger pieces
Red &Green
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TRL parylene DepositionCVD Parylene depopsition
Red
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TRL PMMAspinner PhotoCoat Manual coater for PMMA and other photoresists
Red &Green
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TRL PZTcoater DepositionSpin-Coat Coater to apply PZT films
Red
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TRL PZTfurnace DepositionBake Bake oven for PZT coated wafers
Red
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TRL Resonetics PhotoExpose Laser ablation system
Red
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TRL SU8oven PhotoBake Oven to dry foil from SU8 coater
Purple
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TRL SU8spinner PhotoCoat Manual spin-coater for SU8 resists
Purple
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TRL TBM-8 PhotoBond Front-to-back alignement measurement
Red &Green