Machines by Subcategory: LEAP
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| NANO | Wirebond-Auto | Packaging | Physical, LEAP | Automated wirebonder | ||
| NANO | Wirebond-Ball-Westbond | Packaging | Physical, LEAP | Manual ball bonder | ||
| NANO | Wirebond-Wedge | Packaging | Physical, LEAP | Manual wedge bonder | ||
| NANO | XRay-Inspection | Packaging | Physical, LEAP | X-Ray imaging | ||
| NANO | DieBonder-PickAndPlace | Packaging | Physical, LEAP | Automated pick and place | ||
| NANO | Clean-Ar-Plasma | Packaging | Clean, LEAP | Plasma parts cleaning | ||
| NANO | Oven-Reflow | Packaging | Bake, LEAP | Reflow oven | ||
| NANO | Microscope-QuickVision | Packaging | Physical, LEAP | Automated imaging microscope | ||
| NANO | Freezer-Packaging | Packaging | Physical, LEAP | 0 |