New Process

Machines by Location: Lv5

Fab.nano Packaging space on level 5
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ProcessLabToolProcess CategorySubcategoryDescription
Color Code
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NANO Diesaw-DAD3240 PackagingPhysical Wafer dicing saw
Red
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NANO Wirebond-Ball-MEI PackagingPhysical Gold ball bonder for device packaging
Red
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NANO Wirebond-Auto PackagingPhysical, LEAP Automated wirebonder
Red
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NANO Wirebond-Ball-Westbond PackagingPhysical, LEAP Manual ball bonder
Red
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NANO Wirebond-Wedge PackagingPhysical, LEAP Manual wedge bonder
Red
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NANO XRay-Inspection PackagingPhysical, LEAP X-Ray imaging
Red
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NANO DieBonder-PickAndPlace PackagingPhysical, LEAP Automated pick and place
Red
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NANO Clean-Ar-Plasma PackagingClean, LEAP Plasma parts cleaning
Red
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NANO Oven-Reflow PackagingBake, LEAP Reflow oven
Red
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NANO Microscope-QuickVision PackagingPhysical, LEAP Automated imaging microscope
Red
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NANO Freezer-Packaging PackagingPhysical, LEAP 0
Red
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NANO Microscope-Stereo-Packaging MetrologyPhysical Stereoscope for packaging inspection and work
Red &Green
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NANO Solder-Station PackagingPhysical Solder station for surface mount and rework
Red &Green