New Process

Machines by Process Category: Photo

The key lithography tools to expose photoresists in MTL are: contact aligners ([EV1], EV-LC, [MLA-150] as well as in EML [MA-4]), an i-line stepper (i-stepper) and electron beam lithography (Elionix). Similar to the contact aligners is the system for wafer bonding (EV501 EV620). The choice between these tools will strongly depend on your process needs, such as feature sizes, alignment accuracy, overall design size, type of resist used, as well as sample size, time and operating costs. The [MLA-150] offers a good starting point for most projects, with good feature sizes and alignment accuracy. Mixing different lithography tools is possible, but this is best considered before completing the mask designs, to avoid surprises such as different alignment mark requirements.

Photoresists can be spin-coated in all labs ([coater6], coater, and in EML coater-EML), but some limitations exist for certain resists. 'Specialty' coaters in TRL are the SU8spinner which is required for SU8, the PMMAspinner which is recommended for PMMA, HSQ, and polyimide coating, and the PZTcoater for PZT spin coating. The ICL coater track is ideal for coating and developing standard positive resist, but requires GREEN processes.

Many resists can either be baked in an oven or on a hotplate. This depends on your recipe, the resist used, and the number of wafers/samples. The photo tools (and lithography procedures page) also link to application notes and data sheets that have a lot of excellent in-depth information.

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ProcessLabToolSubcategoryDescription
Color Code
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EBL Elionix Expose Electron beam lithography system
Red &Green
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NANO Asher-SoftLitho Clean, PDMS Oxygen Plasma
Red
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EML coater-EML Coat Photoresist Coater
EML
  +  
EML hotpress Bond Pressing for thermoplastic films
EML
  +  
ICL asher-ICL Clean Single wafer oxygen plasma for photoresist removal
Green
  +  
ICL pTrack Coat Automated coater and developer track
Green
  +  
ICL i-stepper Expose i-line stepper
Red &Green
  +  
TRL asherMatrix-TRL Clean Single wafer oxygen plasma for photoresist removal
Red
  +  
TRL asher-TRL Clean Barrel asher for resist removal
Red &Green
  +  
TRL coater Coat Manual spin-coater for photoresists
Red &Green
  +  
TRL develop-Brewer Coat Resist develop and postbake
Red &Green
  +  
NANO MaskAlign-SoftLitho-EV620 Expose, SU8 Contact mask aligner
Red &Green
  +  
TRL EV501 Bond Bonder system to apply heat, vacuum and pressure
Red &Green
  +  
TRL EV620 Bond Aligner for bonding
Red &Green
  +  
TRL EV-LC Expose Contact mask aligner
Red &Green
  +  
TRL Heidelberg Expose Laser direct-write exposure for wafers and masks
Red &Green
  +  
TRL HMDS-TRL Bake HMDS oven
Red &Green
  +  
TRL hotplate1 Bake Hotplate for lithography
Red &Green
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TRL hotplate2 Bake Hotplate for lithography
Red &Green
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TRL hotplate300 Bake Hotplate for lithography
Red &Green
  +  
NANO MaskAlign-MA6 Expose Contact mask aligner
Red &Green
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TRL DirectWrite-MLA150-OptAF Expose Direct-write lithography for wafers and larger pieces
Red &Green
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TRL DirectWrite-MLA150-AirAF Expose Direct-write lithography for wafers and larger pieces
Red &Green
  +  
TRL OAI-Flood Expose Flood exposure for image reversal resists
Red &Green
  +  
TRL PMMAspinner Coat Manual coater for PMMA and other photoresists
Red &Green
  +  
TRL postbake Bake Bake oven 120C
Red &Green
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TRL prebakeovn Bake Bake oven 90C
Red &Green
  +  
TRL Resonetics Expose Laser ablation system
Red
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TRL SU8oven Bake Oven to dry foil from SU8 coater
Purple
  +  
TRL SU8spinner Coat Manual spin-coater for SU8 resists
Purple
  +  
TRL TBM-8 Bond Front-to-back alignement measurement
Red &Green
  +  
TRL varTemp Bake Bake oven for variable temperature
Red