New Process

Machines by Process Category: Packaging

After a device has been fabricated in the cleanroom, it can be packaged by dicing it out of the wafer, placing it inside a package, making electrical or other connections to it, and sealing it for protection. Most packaging is done in individual research labs, but MTL provides the ability to dice the wafer into small dies as well as allow users to gold wirebond for electrical connections.
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ProcessLabToolSubcategoryDescription
Color Code
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ICL diesaw Physical Wafer dicing saw
Red
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NANO Diesaw-DAD3240 Physical Wafer dicing saw
Red
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NANO Wirebond-Ball-MEI Physical Gold ball bonder for device packaging
Red
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NANO Wirebond-Auto Physical, LEAP Automated wirebonder
Red
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NANO Wirebond-Ball-Westbond Physical, LEAP Manual ball bonder
Red
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NANO Wirebond-Wedge Physical, LEAP Manual wedge bonder
Red
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NANO XRay-Inspection Physical, LEAP X-Ray imaging
Red
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NANO DieBonder-PickAndPlace Physical, LEAP Automated pick and place
Red
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NANO Clean-Ar-Plasma Clean, LEAP Plasma parts cleaning
Red
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NANO Oven-Reflow Bake, LEAP Reflow oven
Red
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NANO Microscope-QuickVision Physical, LEAP Automated imaging microscope
Red
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NANO Freezer-Packaging Physical, LEAP 0
Red
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NANO Solder-Station Physical Solder station for surface mount and rework
Red &Green