New Process

Machines by Process Category: Deposition

Deposition tools in MTL employ different mechanism (shown as their subcategory): sputtering, evaporation, and CVD. Not all materials can be deposited by a particular mechanism. In addition, some deposition tools have very specialized purposes (e.g. CCNT or parylene). Perhaps the broadest range of materials can be evaporated in the (eBeamAu and in EML's [eBeam-AJA]), and evaporators are the only tools that permit the use of photoresist (e.g. for liftoff steps).

For CVD deposition, many tools can deposit very similar films. Here, the materials and process history of your samples may be important in choosing the right tool. One such choice is between the concept1 and the DCVD. The DCVD is more restrictive in the sample history than the concept1. Another example is the choice between the eBeamAu and eBeamFP, which both process RED TRL samples - the eBeamFP has faster pump down due to a fixed set of 6 materials (including Pt and Au), while the eBeamAu may be slower but offers greater material flexibility.

Deposition rates, film quality (e.g. residual gases and film porosity), and tool-specific thickness limitations may also be a concern. Thick films can peel due to stress, and evaporation of thick layers (e.g. over 500 nm) may also result in problems with the crucible in evaporators. Sputtering may be slow (in the AJA-TRL) or fast (in the endura but which required GREEN processes).

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ProcessLabToolSubcategoryDescription
Color Code
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NANO ALD-AllPurpose CVD Atomic Layer Deposition
Red
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NANO Sputter-Balzer Sputter Thin sputter coating of samples
Red
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NANO EBeam-AJA Evaporate Metal and dielectric evaporator
Red
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EML plasmatherm PECVD, RIE Plasma Etch and Deposition
EML
  +  
NANO Sputter-AJA-ChamberLoad Sputter Sputter deposition tool
Red
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ICL ALD CVD Atomic Layer Deposition
Red
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ICL ALD-Oxford CVD, PECVD Atomic Layer Deposition
Green
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ICL concept1 PECVD PECVD deposition of oxides, nitrides, and TEOS
Green
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ICL DCVD PECVD PECVD deposition of oxides, nitrides, and a-Si
Green
  +  
ICL eBeam-EVO Evaporate Metal evaporator of CMOS compatible metals
Green
  +  
ICL endura Sputter Metal sputter deposition
Green
  +  
ICL epi-Centura CVD Not open to public
Green
  +  
ICL Oxford-100_PECVD PECVD Dual chamber PECVD and plasma etch tool
Red
  +  
ICL Oxford-100_Etch RIE Dual chamber PECVD and plasma etch tool
Red
  +  
TRL AJA-TRL Sputter Sputter deposition tool
Red
  +  
TRL Balzer-Elionix Sputter SEM or EBL sample preparation
Red
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TRL CCNT PECVD Carbon nanotube growth
Red
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TRL eBeamAu Evaporate Metal evaporator
Red
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TRL eBeamFP Evaporate Fast pumping metal evaporator
Red
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TRL parylene CVD Parylene depopsition
Red
  +  
TRL PZTcoater Spin-Coat Coater to apply PZT films
Red
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TRL PZTfurnace Bake Bake oven for PZT coated wafers
Red
  +  
TRL sts-CVD PECVD PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
Red
  +  
NANO PECVD-Samco-PD220 PECVD Silicon dielectric PECVD deposition
Red &Green