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Machines by Material Keyword: Pyrex

Pyrex wafers (and therefore leeching out sodium contamination)
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ProcessLabToolProcess CategorySubcategoryDescription
Color Code
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EML acid-hood-EML WetSolvents General Purpose Acid Fume-Hood
EML
  +  
ICL diesaw PackagingPhysical Wafer dicing saw
Red
  +  
NANO Diesaw-DAD3240 PackagingPhysical Wafer dicing saw
Red
MTL Procedures-Etching ProceduresEtch Etching of materials
Red &Green
MTL Procedures-Metrology ProceduresMetrology Test and Measurement
Red &Green
  +  
TRL acid-hood WetAcids Acid processing station
Red &Green
  +  
TRL develop-Brewer PhotoCoat Resist develop and postbake
Red &Green
  +  
TRL EV501 PhotoBond Bonder system to apply heat, vacuum and pressure
Red &Green
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TRL EV620 PhotoBond Aligner for bonding
Red &Green
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TRL Greenflo WetAcids Acid processing station
Red &Green