New Process

Machines by General Keyword: anisotropic etch

Etching is primarily anisotropic (direction specific etch rates)
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ProcessLabToolProcess CategorySubcategoryDescription
Color Code
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ICL AME5000 EtchRIE RIE etcher for frontend silicon processes
Green
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NANO CMP-GnP WetOther Chemical Mechanical Polishing to planarize surfaces
Red &Green
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ICL LAM490B EtchRIE Chlorine based plasma etching of silicon
Green
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ICL LAM590-ICL EtchRIE Fluorine based plasma etching of silicon oxide and nitrides
Green
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ICL Oxford-100_PECVD Deposition, EtchPECVD Dual chamber PECVD and plasma etch tool
Red
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ICL Oxford-100_Etch Deposition, EtchRIE Dual chamber PECVD and plasma etch tool
Red
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ICL rainbow EtchRIE Chlorine based plasma etcher for metals
Green
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ICL TMAH-KOHhood WetAcids Silicon bulk wet etching
Red &Green
  +  
TRL LAM590-TRL EtchRIE Fluorine based plasma etching of oxide and nitrides
Red
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TRL plasmaquest EtchRIE Fluorine and Chlorine general purpose plasma deposition and etch tool
Red
  +  
TRL SAMCO EtchRIE Chlorine based plasma etcher for III-V materials
Red
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TRL sts1 EtchDRIE Deep reactive ion etcher for silicon
Red
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TRL sts2 EtchDRIE Deep reactive ion etcher for silicon
Green
  +  
TRL sts-Pegasus EtchDRIE Deep reactive ion etcher for silicon
Red