New Process

Machines by General Keyword: alignment

The user needs to align the sample to the tool (with varying need for accuracy), usually for lithography but also for test & measurement
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ProcessLabToolProcess CategorySubcategoryDescription
Color Code
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EBL Elionix PhotoExpose Electron beam lithography system
Red &Green
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NANO Dektak-150 Metrology, SoftLithoProfile, SU8 Surface Profilerometer
Red
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NANO Filmetrics-F20 MetrologyThickness Thin Film Optical Measurement
Red &Green
  +  
EML hotpress PhotoBond Pressing for thermoplastic films
EML
  +  
EML parametric-tester MetrologyElectrical Probe station for electrical measurements
EML
  +  
NANO SEM-Neo MetrologySEM Very Basic Electron Microscope
Red
  +  
ICL 4-pt-probe MetrologyElectrical Sheet resistance measurement of semiconductors
Red
  +  
ICL AFM MetrologyProfile Atomic Force Microscope for Surface Analysis
Red &Green
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ICL cv MetrologyElectrical Electrical characterization of dielectrics
Green
  +  
ICL diesaw PackagingPhysical Wafer dicing saw
Red
  +  
NANO Diesaw-DAD3240 PackagingPhysical Wafer dicing saw
Red
  +  
NANO Wirebond-Ball-MEI PackagingPhysical Gold ball bonder for device packaging
Red
  +  
ICL i-stepper PhotoExpose i-line stepper
Red &Green
  +  
ICL P10 MetrologyProfile Stylus profilerometer
Green
  +  
ICL semZeiss MetrologySEM Scanning Electron Microscope
Red &Green
  +  
ICL UV1280 MetrologyThickness Thin film characterization
Green
  +  
TRL dek-NoAu MetrologyProfile Stylus Profilerometer
Green
  +  
TRL dektak-XT MetrologyProfile Stylus Profilerometer
Red
  +  
TRL ellipsometer-TRL MetrologyThickness Thin film thickness measurement
Red &Green
  +  
NANO MaskAlign-SoftLitho-EV620 Photo, SoftLithoExpose, SU8 Contact mask aligner
Red &Green
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TRL EV501 PhotoBond Bonder system to apply heat, vacuum and pressure
Red &Green
  +  
TRL EV620 PhotoBond Aligner for bonding
Red &Green
  +  
TRL EV-LC PhotoExpose Contact mask aligner
Red &Green
  +  
TRL Filmetrics-TRL MetrologyThickness Thin film thickness measurement
Red &Green
  +  
TRL FLX MetrologyProfile Thin film stress measurement
Red &Green
  +  
TRL Hall-probe MetrologyElectrical Carrier measurement
Red
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TRL Heidelberg PhotoExpose Laser direct-write exposure for wafers and masks
Red &Green
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TRL IV-probe MetrologyElectrical Probe station with curve tracer for IV measurement
Red
  +  
NANO MaskAlign-MA6 PhotoExpose Contact mask aligner
Red &Green
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TRL DirectWrite-MLA150-OptAF PhotoExpose Direct-write lithography for wafers and larger pieces
Red &Green
  +  
TRL DirectWrite-MLA150-AirAF PhotoExpose Direct-write lithography for wafers and larger pieces
Red &Green
  +  
TRL nanospec MetrologyThickness Thin film thickness measurement
Red &Green
  +  
TRL Resonetics PhotoExpose Laser ablation system
Red
  +  
TRL TBM-8 PhotoBond Front-to-back alignement measurement
Red &Green
  +  
NANO Wirebond-Auto PackagingPhysical, LEAP Automated wirebonder
Red
  +  
NANO DieBonder-PickAndPlace PackagingPhysical, LEAP Automated pick and place
Red
  +  
NANO Microscope-QuickVision PackagingPhysical, LEAP Automated imaging microscope
Red